ACM Research adds metal peel capability to the Ultra C pr tool to support wafer-level power semiconductor manufacturing and packaging applications

ACM Research, Inc.

First qualified system at a power semiconductor manufacturer in China

FREMONT, Calif., Nov. 11, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ:ACMR), a leading provider of wafer processing solutions for semiconductor and advanced Wafer Level Packaging (WLP), today announced that it has expanded its Ultra C pr product offering to include Metal Lifting (MLO) capabilities for power semiconductor fabrication and wafer level packaging applications. of the wafer (WLP). MLO can be used to save an etching process step, reduce costs, optimize cycle times and significantly reduce chemical demand at high temperatures. The company also announced that the first MLO-compatible Ultra C pr tool has been qualified and put into mass production at a power semiconductor manufacturer in China.

“ACM is committed to strengthening its position as a multi-product company, and we continue to expand our product offering into new opportunities beyond cleaning,” said Dr. David Wang, President and CEO of ACM. “Our Ultra C pr tool has already been widely adopted by customers due to its photoresist stripping capabilities. With MLO, our Ultra C pr tool now supports removing metals from photoresist and removing any excess metals or residue. We are excited about the successful qualification of ACM’s first Ultra pr tool with MLO capabilities, as an initial validation of the technology in a production environment.

ACM addresses the complexities of the MLO application by leveraging the Ultra C pr’s unique combination of wet bench and unique wafer manufacturing technology to deliver the high throughput of a batch tool along with the performance of a superior removal of a single chamber tool. It also has a double filter system ensuring optimal cleanliness during manufacture. Additionally, Megasonic ACM SAPS technology can be configured for MLO to improve cleaning performance of patterned or structured pads.

About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor processing equipment for wet or batch cleaning, electroplating, stressless polishing and vertical oven processes, which are essential for advanced semiconductor device manufacturing. conductors and packaging at the wafer level. The company is committed to providing customized, high-performance, and cost-effective process solutions that semiconductor manufacturers can use across many manufacturing stages to improve productivity and product yield. For more information, visit www.acmrcsh.com.

Forward-looking statements
The information in this press release includes forward-looking statements for purposes of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. All statements in this press release that do not relate to historical facts should be considered prospective. statements, including statements in the first, second, fifth and eighth paragraphs regarding ACM Shanghai’s preliminary expected revenue ranges for the three and nine months ended September 30, 2022, ACM Shanghai’s backlog information as of September 30, 2022 and the potential impacts of new U.S. Department of Commerce regulations. The preliminary financial results and backlog information included in this press release are unaudited and remain subject to review and adjustment. Forward-looking statements are based on the current expectations and beliefs of ACM’s management, and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those indicated or disclosed. – understood by forward-looking statements. These risks and uncertainties include, but are not limited to, the following, each of which could be further exacerbated by the continued COVID-19 outbreak in China and globally: anticipated customer orders or market opportunities identified may not grow or develop as expected; customer orders already received may be postponed or cancelled; ACM may be unable to obtain qualification and acceptance of its delivered tools when scheduled or at all, which would delay or prevent ACM’s recognition of revenue from the sale of such tools; vendors may not be able to respond to ACM requests in a timely manner; ACM’s technologies and tools may not gain market acceptance; ACM may not be able to compete effectively by, among other things, improving its existing tools, adding additional production capacity and engaging other significant customers; ACM may incur significant expenses long before it can recognize new product revenue, if at all, due to the costs and length of research, development, manufacturing and customer evaluation cycles; amounts included in backlog may ultimately not generate revenue; volatility in global economic, market, industry and other conditions could result in a sharp decline in demand for products containing semiconductors and ACM’s products and disruption in financial and trade markets. credit ; ACM’s inability to successfully manage its operations, including its inability to hire, train, onboard and manage additional qualified engineers for research and development activities; and trade regulations, currency fluctuations, political instability and war may have a material adverse effect on ACM due to its large non-US customer and supplier base and significant non-US manufacturing operations. A more detailed description of these risks, uncertainties and other matters can be found in ACM’s filings with the United States Securities and Exchange Commission. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations regarding these forward-looking statements or the occurrence of unforeseen events.

© ACM Research, Inc. Smart Megasonix and the ACM Research logo are registered trademarks of ACM Research, Inc. For convenience, this mark appears in this press release without the ™ symbol, but this practice does not imply that ACM will not assert, to the fullest extent consistent with applicable law, its rights in this mark.

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Jillian Carapella

UNITED STATES

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Robert Metter

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Xi Wang

ACM Research (Shanghai), Inc.

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A.A. Kim

ACM Research (Korea), Inc.

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David Chang

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